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Highest Natural Thermal Conductivity Low Expansion Coefficient for Optoelectronic Device Cooling High Thermal Conductive Diamond
Highest Natural Thermal Conductivity Low Expansion Coefficient for Optoelectronic Device Cooling High Thermal Conductive Diamond
Highest Natural Thermal Conductivity Low Expansion Coefficient for Optoelectronic Device Cooling High Thermal Conductive Diamond
Highest Natural Thermal Conductivity Low Expansion Coefficient for Optoelectronic Device Cooling High Thermal Conductive Diamond
Highest Natural Thermal Conductivity Low Expansion Coefficient for Optoelectronic Device Cooling High Thermal Conductive Diamond
Highest Natural Thermal Conductivity Low Expansion Coefficient for Optoelectronic Device Cooling High Thermal Conductive Diamond
Highest Natural Thermal Conductivity Low Expansion Coefficient for Optoelectronic Device Cooling High Thermal Conductive Diamond
Highest Natural Thermal Conductivity Low Expansion Coefficient for Optoelectronic Device Cooling High Thermal Conductive Diamond
Highest Natural Thermal Conductivity Low Expansion Coefficient for Optoelectronic Device Cooling High Thermal Conductive Diamond
Highest Natural Thermal Conductivity Low Expansion Coefficient for Optoelectronic Device Cooling High Thermal Conductive Diamond

Highest Natural Thermal Conductivity Low Expansion Coefficient for Optoelectronic Device Cooling High Thermal Conductive Diamond

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Products Description

Engineered for extreme thermal management — Hope CVD diamond substrate delivers unmatched heat conductivity up to 2200 W/m·K.

As the hardest known natural substance, diamond features a wide bandgap, broad optical transparency range, minimal compressibility, and the highest thermal conductivity at room temperature. It also exhibits excellent chemical inertness toward most substances, making it ideal for use in extreme conditions such as high temperature, high pressure, and high frequency.

In terms of thermal properties, diamond is the most thermally conductive material found in nature, with a thermal conductivity of 2000–2200 W/m·K at room temperature—about four times higher than silicon carbide (SiC), thirteen times higher than silicon (Si), forty-three times higher than gallium arsenide (GaAs), and four to five times higher than copper or silver.

Modern high-power electronic and opto-electronic devices—such as those used in 5G applications, high-speed computing, and high-power semiconductor chips—generate intense heat within a very small area, creating serious cooling challenges. To achieve rapid heat dissipation, highly thermally conductive materials are required for heat sinks and coatings at the heat-generating ends (such as radiators, fans, or thermal substrates). With its exceptionally high thermal conductivity across a wide temperature range, extremely low thermal expansion coefficient, and electrical insulation at room temperature, diamond has become the optimal choice for advanced thermal management solutions.



Figure  (a) Sapphire substrate without dielectric. (b) Diamond substrate without dielectric. (c) Diamond substrates with PMMA interlayer.


Product Paramenters




Hope-30

High Thermal Conductivity Diamond Micron Powder (50nm~50μm)
This is a diamond powder with very small particles (micron or nano size). It has a tight particle size range, good shape, and very high purity. There are very few defects inside, and it conducts heat extremely well.
It can be used as a special filler, mixed evenly into different materials. It is also used to make thermal products like thermal grease, thermal glue, and thermal pads.



Hope-40

Etched thermal conductive diamond (30~540μm)

The main purpose of etching diamond is to change its surface morphology and increasethe specificsurface area, thereby improving the interface contact area between diamond and metal matrixmaterials.This helps with heat transfer at the interface, reducing the thermal resistance at the interface, thus improvingthe overall thermal conductivity of diamondcomposites.



Hope-50

Spherical Thermal Conductive Diamond (20~600μm)

Spherical diamond has a regular spherical or nearly spherical shape, with a high specific surface area, good adsorption capacity, and ease of filling. In composite materials, spherical diamonds can be better dispersed in the matrix, reducing the gaps between particles and the interfacial thermal resistance, thereby improving the overall thermal conductivity. In addition, the spherical shape helps to increase the contact area and bonding strength between the diamond and the matrix, further facilitating heat transfer.




Hope-60

Native thermal conductive diamond (30~540μm)

he company adoptsspecialproduction processes, and the produced diamond for thermal conductivity hasextremely low internal impurities (non-diamond carbon, nitrogen impurities, etc.), good thermal stability, few lattice defects, high hardness, and good wear resistance, among other excellent characteristics. The surface has undergone high-purity treatment, improving the thermal boundary, which can achieve very low interfacial thermal resistance and high thermal conductivity, making it suitable for the production of high-end thermal interface materials.
The grades are divided into HTCD-AGT, HTCD-AGP, HTCD-AGH, HTCD-AGG, with particle sizes ranging from 30 to 540 μm.





H-Coated

Thermal conductive coated diamond (30~540μm)

Through innovative diamond coating technology, a coating with high thermal conductivity and good processing performance is formed Uniformly coated diamond, the coating can suppress thermal damage to the diamond material, improve the thermal stability of the diamond, and enhancethe wettability between diamond and metalsubstrates(such as aluminum, copper, etc.), thereby enhancing the interfacial bonding strength, reducing interfacial thermal resistance, and improving the thermal conductivity of the material. 

Hope diamond can provide various metal coatings,non-metal coatings and alloy coatings, including: titanium(Ti), chromium (Cr), copper (Cu), aluminum (Al), molybdenum (Mo), zirconium (Zr), tungsten (W), cobalt (Co), silicon (Si), copper-tin alloy (CuSn), copper-chromium alloy (CuCr), etc.



Company Profile

Zhengzhou Hope Superhard Material Co.,Ltd is located in Zhengzhou High-tech Industrial Development Zone. With our proprietary technologies and Self-developed Equipment, we have developed into a high-tech private company integrating scientific research, manufacturing, and sales.

 We provide full-range of synthetic diamond and related products including Lab-Grown Diamond, Diamond Powder, Large Single Crystal Diamond, Diamond Micro powder, CBN Powder, MCD and PCD Wire Drawing Die Core, PCD, PDC, PCBN, CVD and Single Crystal Diamond Tool, Wire Drawing Die, Diamond Grinding Wheel etc. These products serve diverse industries such as Aerospace, Electronics, Optics, Machinery, Energy Exploration, Construction and Jewelry.

 We are committed to the fundamental principles of exceptional corporate credibility and product quality, leveraging sincere customer service as a bridge to collaboratively create a bright future with our clients.

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FAQ

1. What are your business scopes?

-We are a superhard material manufacturer with 20+ years of experience. Our main products include single crystal and polycrystalline diamond, CBN, various micro powders, PCD, PDC, TSP, CVD, PCBN etc and related tool products.

2. What payment methods do you accept?

-We accept T/T, L/C, Alibaba Trade Assurance, and other secure payment methods. Please contact us for more options.

3. Do you offer OEM/ODM services?

-Yes, we provide customized OEM/ODM services, including logo printing, packaging design, andproduct specifications tailored to your requirements.

4.Can I get a sample before placing a bulk order?

-Yes, we do provide samples for quality evaluation, but the buyer is responsible for the sample and shipping costs.

5. What is your production lead time?

-After order confirmation and deposit payment, our standard production time is 7 working days for a regular order. This time may vary based on the order quantity, product complexity, and customization requirements.

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