Product Overview: Pressureless Sintered Diamond Segments
The images depict stacks of precisely manufactured Pressureless Sintered Diamond Segments. These segments, characterized by their rectangular blocks with a curved top edge, are the core cutting components of high-performance diamond tools. They are produced by bonding high-grade synthetic diamond crystals with a special metal powder matrix (e.g., cobalt, copper, tungsten) using advanced powder metallurgy technology.
The segments have a uniform silver-gray to dark gray appearance, with a sintered metal texture visible on the surface. This structure, which includes fine, controlled porosity, is crucial for performance. One side is brazed onto a tool body (like a saw blade or drill bit core), while the curved, working face (shown with slight wear marks in the images) performs the cutting.(More types of Diamond saw blade)
Core Manufacturing Process: Pressureless Sintering
Pressureless sintering is the key technology for manufacturing these segments. The process involves the following steps:
Mixing:Precisely measured synthetic diamond grit and metal bond powder (matrix) are uniformly blended.
Cold Pressing:The mixture is loaded into a mold and compacted under high pressure at room temperature to form a "green" segment blank with preliminary strength and defined shape.
Pressureless Sintering (The Critical Step):The green blanks are sintered in a high-temperature furnace under a protective atmosphere (e.g., hydrogen, argon). The temperature is raised below the melting point of the metal matrix. Unlike hot pressing, no external pressure is applied. Densification occurs through atomic diffusion, creating a strong alloy matrix that firmly holds the diamond crystals.
Post-Sintering Processing:After sintering, the segments undergo controlled cooling and necessary finishing (e.g., sizing) before rigorous quality inspection.
Process Advantage:Compared to hot-press sintering, pressureless sintering offers higher production efficiency, lower relative cost, and allows for controlled porosity, which enhances chip removal and cooling during cutting.
Key Product Characteristics
Exceptional Hardness & Wear Resistance:Diamond, the hardest known material, provides an extremely long service life and consistent cutting performance.
Excellent Self-Sharpening:The softer metal matrix wears down at a controlled rate, continuously exposing new, sharp diamond crystals to maintain a consistently sharp cutting surface and prevent glazing.
High Cutting Efficiency:Enables fast cutting speeds on hard, brittle materials with clean, precise cuts.
Effective Heat Dissipation:The inherent micro-porosity from the sintering process helps accommodate swarf and dissipate heat, reducing thermal damage to both the segment and the workpiece.
High Customizability:The segment's performance can be tailored for specific materials by adjusting the bond matrix composition (hardness, wear resistance) and diamond,specifications(grit,size,concentration).
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Typical Specifications
Specifications are customizable based on application requirements. Key parameters include:
