Ceramic Silicon Wafer Thinning Wheel

Wafer Thinning

Main Features
High grinding efficiency, 

Longer life, 

Good shape retention,

Better surface quality

Silicon wafer manufacturing process
Ingot, cutting, peripheral grinding, ingot slicing, double disc grinding or grinding, edge grinding, surface grinding, polishing, back grinding, dicing, chipping 

Application of silicon wafer thinning grinding wheel
Back grinding, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, gallium arsenide, GaN wafers, silicon-based chips, etc.

Applicable to grinders in Japan, Germany, the United States, South Korea and other countries. Such as NTS, SHUWA, ENGIS, Okamoto, Disco, TSK, STRASBAUGH grinders, etc.

Silicon wafer thinning grinding wheel specifications

Case study of vitrified diamond wheels for silicon wafer grinding in the microchip industry