Diamond grinding wheels are most widely used in the processing of hard and brittle materials such as crystalline silicon and sapphire. In the photovoltaic industry, they are mainly used in the rounding and grinding of single-crystal silicon rods, and the squaring, chamfering and grinding of polycrystalline silicon.
Diamond grinding wheels are also needed in large quantities for the grinding and chamfering of single-crystal silicon and polycrystalline silicon. The processing procedures are divided into rough grinding and fine grinding. The diamond grain sizes are 120/140, W40, W28, W20, etc.
The processing flow of single crystal silicon mainly includes: truncation; rounding; squaring; flat grinding ; slicing ; chamfering ; grinding; chemical etching; polishing, etc.
| Diamond tools for silicon material processing | |
| Processing Steps | Diamond Tools |
| Cut off | Diamond Circular Saw Blades Diamond Band Saws |
| Rounding | Diamond Grinding Wheel |
| Cutting | Diamond Circular Saw Blades Diamond Wire Saws |
| Grinding | Metal or Resin Bond Grinding Wheels |
| Slice | Diamond Internal Circular Saw Blades Diamond Wire Spacing |
| Chamfer | Diamond Grinding Wheel |
| Polishing | Diamond Grinding Wheel |
| Scribing or chip cutting | Diamond Thinning & Cutting Wheel |
| Model | Plane Section Schematic (CAD Drawing) | Common specifications | |||
| outer diameter D | Thickness T | Aperture H | Ring Width X(W) | ||
| 6A2T | ![]() | 220 | 65 | 130 | 5 |
| 6A2H | ![]() | 200 | 35 | 76 | 5 |
| 200 | 60 | 80 | 5 | ||
| 11A2 | ![]() | 100 | 28/40 | 31.75/20 | 5 |
| 1A1 | ![]() | 300 | 35 | 127 | 5/7/10 |
| 6B9H/C | ![]() | 300 | 50 | 48 | 10/20 |
| 6A2T/C | ![]() | 250 | 60 | 38.1 | 10/15 |
If you have other specifications, we can also customize them according to the drawings!