Semiconductor Silicon Wafer Bevel Grinding Wheel

External edge grinding of single crystal silicon wafers and chamfering of sapphire substrates

Semiconductor Silicon Wafer Bevel Grinding Wheel

 

It is mainly used for chamfering of silicon wafers and silicon carbide wafers of various sizes and chamfering of sapphire substrates. The groove shape and quantity are designed according to the requirements. It has good shape retention, long service life and no defects in the processed workpiece.

1.5 inches 2 inches 6 inches 8 inches

Single groove, double groove, 3 groove, 5 groove, 6 groove, 8 groove, 9 groove, 11 groove and other specifications of diamond chamfering grinding wheels

All kinds of R-type grooves, T-type grooves, complete sizes, various groove types can be customized.